The filler is a papery gray substance, black only on top. Do you think I can melt it out more gracefully than chiseling?
(I'm worried about damaging the components on the board, as some have done above.)
I wasn't sure whether to start a new short thread, or to post here, but, I've seen enough butchered keys and plastic flakes in ABS control module goop to ask before attempting to clean out my FSU.
There are plenty of pictures of cleaned out FSUs (showing the circuit board), and even some (see above) where they broke components off the circuit board, but no pictures (to my knowledge) of
HOW they removed the black goop at the bottom of the FSU.
So, before I ruin mine, may I ask: How do you suggest we clean this stuff out without damaging the circuit board underneath. (I really wish I knew what I was doing.)
How deep is that circuit board anyway?
The fill looks VERY shallow in some of the pictures - but my chisel went in deeply as shown below.
FIRST PASS:
EDIT: What 'is' this gray papery stuff anyway? It seems to have filaments throughout it, like heavy cardboard or something?
SECOND PASS:
On this third pass, I hit some of the components!
There must be a more graceful way to remove this papery stuff.
THIRD PASS:
OK. I'm about to ruin this thing as more components are popping up!
I tried to see if I could melt it out, but the stuff just burns!
Well, the stuff is rubbery like a pencil eraser, and about 1/8" inch thick. I wish there was a more graceful way, but here is where I am:
Digging onward ...
Unfortunately, at this point, I've already ruined the FSU (but I don't know it yet), as that shiny thing below is the INSIDE of a chip!
It's getting dangerously close to the components ...
At some point, the chisel was far too large and impassionate, so I tried these dental picks, which were too small & personal:
Now it's getting nearer to the components, which I don't want to knock off the board (or cut a trace):
Even though it's ruined, I may as well continue to dig away, just to see what's down there: